will check the packaging condition,Outer labels,carrier tape/trays.
The actual devices will be inspected for correct markings, country of origin, datecodes, blacktopping, contamination, lead defects, tool/sand markings, logo markings, and construction defects.
These tests will tell if the components are NEW and UNUSED from remarked
This can further prove or disprove the authenticity of ICs.
It checks whether the die has been re-assembled or re-packaged or to verify whether a gross functional failure during IC test has been generated by physical damage or overstress.
To check the electrical parameters of every pin to pin e.g. current, voltage, diode resistivity, and silicon connectivity.
This is a very strong tool which allows us to detect whether a component is defective or not.
Key Functional Testing
Check for the main aspects of the device detailed on the Datasheets using a designed test circuit.